We have a few weeks more before the MWC 2016 officially rolls in and we’ll get to see some new smartphones for the year. Expected during the MWC festivities is LG’s new flagship, the LG G5. The Korean manufacturer has certainly not been secretive about the upcoming phone’s features, but a benchmark will give us an idea of what’s inside.
The LG G5 has been spotted in GeekBench’s database, and we have a clear idea of what’s under the hood. The MSM8996 motherboard betrays the Qualcomm Snapdragon 820 chipset inside. This is a return to form for LG, as they went for the lower Snapdragon 808 last year on the LG G4, for fear of the SD810’s overheating issues. The chipset is supported by 4GB RAM, standard fare for flagships these days.
With LG’s streamlined UI, 4GB RAM will be well utilized. The phone will seemingly launch with Android 6.0.1 Marshmallow out of the box, and all the new features that come with that. Other rumored specs of the LG G5 include some sort of modular battery, a 5.6-inch QuadHD display, a 20MP camera, and a return to traditional side-mounted buttons.
LG has also released information on a touch-enabled cover, something novel from the Korean manufacturer. It feels like a new era for LG, so it is exciting to see them fight for top tier spots again – even going head-to-head with Samsung by launching their device earlier on the day the Samsung Galaxy S7 will be launched. MWC 2016 couldn’t be more exciting.
SOURCE: Geekbench
