For gearheads and tinkerers, nothing is more exciting than a teardown – picking out the nuts and bolts of a system and getting to the heart of a device. Sony’s newest flagship – the Xperia Z3, recently launched at the IFA 2014 trade show in Berlin – gets a full teardown, revealing the innards of the premium device.
Powering the Xperia Z3 is the Snapdragon 801 SoC that seems to be the favorite of most manufacturers these days for their flagship devices. That is supported by a very generous 3GB of RAM which pushes pixels to a 5.2-inch Full HD 1920×1080 display. The internal storage of the device that was torn down is 16GB, and the device’s storage is usually expandable via microSD to 128GB.
The teardown was straightforward, the only challenge being the Xperia Z3’s unibody design and the IP68 grade waterproofing, the latter meaning that most seams of the device has some sort of rubberized sealant. With a little heat and a prying tool, you can gain entry to the device via the backplate, and everything should be straight forward from there (unlike the Samsung Galaxy Alpha’s “screen first” entry).
The parts are modular to the core, and so replacement of parts should be easier once you have gotten past the back plate. The phone’s design is compact, meaning that you have to be careful with cables and elements which have very specific placements. But if you do teardowns for a living, the Sony Xperia Z3 should be a normal day at work.
SOURCE: eWiseTech
