Qualcomm’s Snapdragon 810 chipset feels like the unwanted child of the China-based brands hugely successful Snapdragon series mainly because of the bad rep it t got about overheating issues that usually affected performance in most devices. Now whether Qualcomm admits it or not, we’ve got some pretty convincing real world evidence that the Sony Xperia Z4/Z3+ experienced heavy throttling with its SD810 processor as tasks were repeated over and over, thus lowering the performance of the premium device. And now, the same chipset is present in the Sony Xperia Z5 and Xperia Z5 Premium. Will the problems be the same?
Apparently not. Early user feedback has given us the idea that the Sony Xperia Z5 performs a lot better than its predecessor. And now, some teardown images reportedly of a Sony Xperia Z5 Premium and a standard Xperia Z5 would seem to have the answer to why the SD810 in these devices perform better than the ones from a year before – dual heat pipes. The first image below shows the Xperia Z3 design, with a single heat pipe. The second image is a purported Xperia Z5 Premium teardown image with the dual heat pipe design.
Heat pipes are used to dissipate heat from a processor, and it looks like Sony might be employing two of those just to minimize the heat from the SD810 processor in the Xperia Z5 Premium. Also, an image of a standard Xperia Z5 that was torn down also came out, showing the same dual heat pipe design as with its more expensive sibling. See the image below.
Now we know what Sony might have done to make sure that their SD810 processors perform for the Xperia line. Last year’s iterations were surely a miss for the company, and they would probably sooner forget about those devices. Now we have a new Xperia flagship out, and it’s good to know that the performance will be worth the premium pricing.
VIA: Xperia Blog
Heat has to go somewhere