As people expect more and more things from their smartphones, it puts a lot of pressure on OEMs to not overclock and over-exert the insides of these devices to the point that they will overheat, and in some extreme cases, even short circuit or catch fire. Rumors are coming out of South Korea (from a Chinese website) that Samsung is looking for heat-pipe technology providers so they can install them in their upcoming new flagship, the Galaxy S7, set to be released early next year.
The way this tech works is that there are tiny pipes inside your device that are filled with liquid coolants. They will then circulate around components that generate heat, like chipsets, and then take away the excess heat with them. Heat-pipes are nothing new for gaming PCs, but for mobile devices, it still is a challenge to incorporate them into the system because it is relatively bulky and as we know, space is prime real estate in a smartphone.
The Sony Xperia Z5 and Microsoft’s Lumia 950 XL have both used this technology so there must be a work around. Samsung is reportedly looking for something that will just be .6 mm thin or even smaller. Coincidentally, Fujitsu announced earlier this year that they have come up with a system that will sandwich six .1mm layers together that they claim is five times more effective than previous versions.
Now whether Samsung and Fujitsu will get together, or whether the former will find another provider remains to be seen. But it should be interesting if they will be able to get a space-saving heat-pipe system that will work well with either an Exynos processor or a Qualcomm Snapdragon 820 (both are rumored for the Galaxy S7).
They just need to bring back removable battery and IR blaster in the Note 6 and I’ll be happy.
Yes i am agree