Qualcomm has come forward with an official announcement for their RF360 Front End Solution. This is described as being a “comprehensive, system-level solution” that takes the issue of radio band fragmentation into consideration. Or in simpler terms, the Qualcomm RF360 Front End Solution will allow OEMs to integrate a single and global 4G LTE design in mobile devices.
Basically, one 4G LTE setup that will work globally. The RF360 will include support for all seven cellular models including LTE-FDD, LTE-TDD, WCDMA, EV-DO, CDMA 1x, TD-SCDMA and GSM/EDGE. Perhaps more important, it will be able to do that and still offer perks such as using less power which in turn will increase the battery life and overall performance of your device. Qualcomm also touts this solution as being able to keep the reception at higher levels — including helping when it comes to the issue of having your bars drop when you hold your phone.
Diving a bit further in, Qualcomm has said they have integrated the power amplifier and antenna switch and then integrated the RF band components on another package. When these are combined they will make up what is being called the “industry’s first 3D-RF packaging” (aka, RF POP). Take those and combine them with the antenna tuner and envelope tracker it becomes the “first system level solution to enable global LTE with a single design.”
Despite the fact that sounds like quite a bit, Qualcomm has said the RF360 will be half the board area and just a mm thick. Or what may be of more interest to the end user — this will allow OEMs to build thinner devices. Not to mention, the Qualcomm RF360 will allow for one handset design that has worldwide support for 2G, 3G, 4G and LTE connectivity which means frequent travelers should have it a bit easier. Finally, while we have no word on specific devices that may use this technology just yet, Qualcomm has said that they expect it to be in use during the second half of 2013.