A new Huawei Ascend phone is said to be in the works right now and is currently being tested internally according to MyDrivers, a Chinese website. Rumor has it that this smartphone will be a follow up to the Huawei Ascend P7 which was released earlier this year.
The Huawei Ascend P8 is expected to be unveiled at the CES 2015 this coming January so this should be interesting. No confirmation has been made yet but MyDrivers said that the Android smartphone will feature a 5.2-inch display, a 1080 x 1920 pixel resolution, and might be powered by a 16 nm FinFET octa-core Kirin 930. It’s also believed that the smartphone will have tapered edges similar to the iPhone 6.
What’s more interesting about this rumor is that the phone will include ceramics and metal into the build. Phone could have a ceramic back and a metal body and could be priced at 2,999 CNY which is about $489.
We’re not quite sure about the use of octa-core Kirin 930 because we know that TSMC will ship the advanced silicon later in 2015. An early 2015 arrival of the Ascend P8 running the processor just doesn’t make sense. It’s either a different chip will be used or TSMC is set to deliver the product earlier as planned. We’ll see.
VIA: Phone Arena
