It’s right about time for China-based manufacturer Huawei to put out an update to their high-end smartphone line, so people are beginning to whisper that the Huawei Ascend P8 might soon be unveiled. True enough, Huawei has sent out invites for an April 15 event in London where it might just do that. For now though, we will have to be satisfied with these leaked images that supposedly came straight from the manufacturing line of the new smartphone.
Twitter account @Onleaks has put out a couple of images to help us work out what we could possibly expect. The first image (above) shows us the bottom section of what is purportedly the new Huawei Ascend P8. Pretty standard here – we see a microUSB port and two speaker grilles. The big deal? It seems like the phone’s body is made up of some kind of metallic material, surprise surprise.
The next image is of some schematics reportedly of the same phone. The image shows a remarkably slim phone at 6.6mm, with design cues coming from both Apple’s iPhone 6 and Samsung’s Galaxy S6. In their defense, there’s only so much you can do when you go with a metallic frame, really. The interesting portion is a rectangular strip below the camera module whose purpose is undefined as of now, but rumors are flying about that it could be a fingerprint sensor. Well, hello.
Huawei’s London event will most probably be centered on the Ascend P8, whose pricing is rumored to be around USD$480. With rumored flagship specs – a Kirin 930 octa-core processor, 3GB of RAM, and a 5.2-inch full HD display – that pricing will seriously undercut Samsung and HTC’s new flagship offerings. We’ll be on the lookout on April 15th for the latest on this new phone.
