You know what they say about TENAA once you come out in the Chinese certification website, all the details included are almost good as confirmed. This will probably be the case with Huawei’s new flagship, the P8 as the official unveiling is just a few days away. But the pictures and specs leaked from the website, more or less confirms what has been bandied about and we can expect that the “final product” will more or less have these features and specifications.
While Huawei has not officially announced that the new flagship is going to be the P8, but we can probably trust the details that have been revealed in the TENAA site. There will be six different versions, with three of them carrier-specific. The images show a device that will be a mixture of plastic and metal (as rumored earlier) and that it will have super thin bezels. The earlier reports that it will be just 6mm thick may be probable based on the pictures, but there is no indication as to its exact thinness. The metal part would be the frame and the back finish, and some areas seem to be made of plastic, like the strip around the camera.
Interestingly enough, the left side of the device is completely clean, since all the buttons (power, volume, microSD slot, SIM card are all located in the right side. Regarding the inside, it will reportedly run on Hisilicon Kirin range, the 64-bit octa-core Kirin 930 and it will have 3GB RAM and 32GB internal storage. Display is expected to be at full HD with 10802p resolution. Another rumor that has been floating around is that it will come with dual SIM, which the TENAA site shows it will.
The P8 will be officially announced and unveiled during Huawei’s big event on April 15. Of course we’ll be updating you more about the smartphone as the date comes closer and even during the date itself, including if it will really be priced at around $480.
VIA: Gizmo China
